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We report on the growth of high-quality GaAs semiconductor materials on an AlAs/sapphire substrate by molecular beam epitaxy. The growth of GaAs on sapphire centers on a new single-step growth technique that produces higher-quality material than a previously reported multi-step growth method. Omega-2theta scans confirmed the GaAs (111) orientation. Samples grown at 700 °C displayed the highest crystal quality with minimal defects and strain, evidenced by narrow FWHM values of the rocking curve. By varying the As/Ga flux ratio and the growth temperature, we significantly improved the quality of the GaAs layer on sapphire, as compared to that obtained in multi-step studies. Photoluminescence measurements at room temperature and 77 K further support these findings. This study underscores the critical role of the As/Ga flux ratio and growth temperature in optimizing GaAs epitaxial growth on sapphire. 

In the manufacture of semiconductor devices, cracking of heterostructures has been recognized as a major obstacle for their post-growth processing. In this work, we explore cracked GaN/AlN multi-quantum wells (MQWs) to study the influence of pressure on the recombination energy of the photoluminescence (PL) from the polar GaN QWs. We grow GaN/AlN MQWs on a GaN(0001)/sapphire template, which provides 2.4% tensile strain for epitaxial AlN. This strain relaxes through the generation and propagation of cracks, resulting in a final inhomogeneous distribution of stress throughout the film. The crack-induced strain variation investigated by micro-Raman spectroscopy and X-ray diffraction mapping revealed a correlation between the spacing of the cracks and the amount of strain between them. We have developed a 2D model that allows us to calculate the spatial variation of the in-plane strain in the GaN and AlN layers. The measured values of compressive in-plane strain in the GaN QWs vary from -0.4 % away from cracks, to -0.7 % near cracks. PL from the GaN QWs exhibits a clear correlation to the varying strain resulting in an energy shift of ∼ 140 meV. As a result, we can experimentally calculate a pressure coefficient of PL energy of ∼ -60.4 meV/GPa for the ∼ 7 nm thick polar GaN QWs. This agrees well with the previously predicted theoretical results by Kaminska et al. in 2016 [DOI: 10.1063/1.4962282], which were demonstrated to break down for such wide QWs. We will discuss this difference with respect to the reduction in both the expected point defects and extended defects resulting from not doping and growth on a GaN template, respectively. As a result, our work indicates that cracks can be utilized for investigating some fundamental material properties related to strain effects. 

In this work, we study the thermal evolution of the optical and electrical features of an InN thin film. By correlating photoluminescence (PL) and Hall effect results, we determine the appropriate values of the correlation parameter to be used in the empirical power law that associates the electron concentration with the linewidth of the PL spectrum, in the scope of the Burstein–Moss effect across a wide range of temperatures. Additionally, by associating Raman and PL results, we observe the thermally induced compressive strain widening of the bandgap of the InN film. Our findings demonstrate the reliability of optical methods in providing contactless measurements of electrical and structural features of semiconductors. 

The study aimed to investigate the underlying physics limiting the temperature stability and performance of non-surface passivated Al0.34Ga0.66N/GaN Hall effect sensors, including contacts, under atmospheric conditions. The results obtained from analyzing the microstructural evolution in the Al0.34Ga0.66N/GaN Hall sensor heterostructure were found to correlate with the electrical performance of the Hall effect sensor. High-resolution x-ray photoelectron spectroscopy studies revealed the signature of surface oxidation in the GaN cap layer, as well as a slight out-diffusion of “Al” from the AlGaN barrier layer. To prevent the formation of a bumpy surface morphology at the Ohmic contact, we investigated the impact of “Pt” top Ohmic contacts. The application of a top “Pt” contact stack resulted in a smooth Ohmic contact surface and provided evidence that the bumpy surface morphology in Au-based Ohmic contacts is due to the formation of an Al-Au viscous alloy during rapid thermal annealing. In the early stages of thermal aging, the small drop in contact resistivity stabilized with subsequent thermal aging past the initial 550 h at 200 °C. The outcome is that the Al0.34Ga0.66N/GaN Hall effect sensors, even without surface passivation, exhibited a stable response to applied magnetic fields with no sign of significant degradation after 2800 h of thermal aging at 200 °C under atmospheric conditions. This observed stability in the Hall sensor without surface passivation can be attributed to a self-imposed surface oxidation of the cap layer during the early stages of aging, which serves as a protective layer for the device during subsequent extended periods of thermal aging at 200 °C.